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De-Lidding, OC Core 7700K, Tom's Hardware

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Wouldn't it be great if Intel spent a few dollars more on a higher quality thermal paste? 

My computer: ABS Gladiator Gaming PC featuring an Intel 10700F CPU, EVGA CLC-240 AIO cooler (dead fans replaced with Noctua fans), Asus Tuf Gaming B460M Plus motherboard, 16GB DDR4-3000 RAM, 1 TB NVMe SSD, EVGA RTX3070 FTW3 video card, dead EVGA 750 watt power supply replaced with Antec 900 watt PSU.

42 minutes ago, stans said:

Wouldn't it be great if Intel spent a few dollars more on a higher quality thermal paste? 

 

It would, but actually, although the Dow Corning paste used by Intel isn't exactly the best, it's still a reasonable paste.

The primary issue with the TIM/die interface is the adhesive used to  attach the IHS. It increases the gap between IHS and die, necessitating a thicker layer of TIM.

The article linked to is interesting, but I was surprised they didn't test Coolllaboratory's Liquid Pro or Ultra, given that it's the best and generates the lowest CPU temp. Why on Earth would you go to the trouble of writing an article and publishing it online but fail to use the most obvious TIM?

31 minutes ago, martin-w said:

 

It would, but actually, although the Dow Corning paste used by Intel isn't exactly the best, it's still a reasonable paste.

The primary issue with the TIM/die interface is the adhesive used to  attach the IHS. It increases the gap between IHS and die, necessitating a thicker layer of TIM.

The article linked to is interesting, but I was surprised they didn't test Coolllaboratory's Liquid Pro or Ultra, given that it's the best and generates the lowest CPU temp. Why on Earth would you go to the trouble of writing an article and publishing it online but fail to use the most obvious TIM?

 

That's what all of these noobs do.  Linus Tech Tips did the same thing a few months back and their conclusion was "it's not worth it".  Well no **** it's not worth if if you do it wrong.  

34 minutes ago, martin-w said:

 

It would, but actually, although the Dow Corning paste used by Intel isn't exactly the best, it's still a reasonable paste.

The primary issue with the TIM/die interface is the adhesive used to  attach the IHS. It increases the gap between IHS and die, necessitating a thicker layer of TIM.

The article linked to is interesting, but I was surprised they didn't test Coolllaboratory's Liquid Pro or Ultra, given that it's the best and generates the lowest CPU temp. Why on Earth would you go to the trouble of writing an article and publishing it online but fail to use the most obvious TIM?

Sponsorship, Thermal Grizzly Conductonaut its like pro and ultra all 3 is inside a couple of deg C.

Cant say witch the best, probaly the Ultra mostly for easy to applay , i use the conductonat to bypas the powersensing on the nvidia gpu.s 

Wiz  is a very experianced overclocker , former Rog now MSI tester.

4 hours ago, TechguyMaxC said:

 

That's what all of these noobs do.  Linus Tech Tips did the same thing a few months back and their conclusion was "it's not worth it".  Well no **** it's not worth if if you do it wrong.  

 

Yes I saw that video Max. I recall he used some crappy TIM he had hanging around. Two possibilities occurred to me. Either he was completely ignorant of what delliding was all about, or alternatively he had some kind of agenda. 

I favour the later, as he must of researched delidding before he gave it a bash.

4 hours ago, westman said:

Sponsorship, Thermal Grizzly Conductonaut its like pro and ultra all 3 is inside a couple of deg C.

Cant say witch the best, probaly the Ultra mostly for easy to applay , i use the conductonat to bypas the powersensing on the nvidia gpu.s 

Wiz  is a very experianced overclocker , former Rog now MSI tester.

 

Oh right, thanks Hasse. I wasn't aware that Grizzly Conductonaut was so effective.

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