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4930K / 4960K Overclocking / Heat?

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Hey guys, does any one here by any chance is running the 4930k or the 4960k?

do you know if it has a large overclocking (due to heat) headroom like the previous Sand Bridge-E "X series" CPU has?

or it is very similar to the regular Ivy Bridge which had heat issues? and some went to the extreme and removing the CPU lid because of that.

 

any Info will be helpful regarding the OC head room with the new Ivy Bridge-E CPU.

 

thanks.

Joel Strikovsky
Banner_FS2Crew_NGX_Driver.jpg

I have the 4960 and it came OC'd at 4.3 GHZ. I am not sure if it can go higher or not as I haven't run any of the tests that were suggested since I don't have a monitor yet. I will share the results and maybe that will help you I dunno.

or it is very similar to the regular Ivy Bridge which had heat issues?

 

From overclockers.com: http://www.overclockers.com/intel-ivy-bridge-e-4960x-cpu-review

 

The reviewer says fluxless solder was used not non-solder TIM, and says he got 4.6Ghz which is decent even for SB-E w/ 6 cores running.

Noel

System:  9900X3D Noctua NH-D15 G2, MSI Pro 650-P WiFi, G.SKILL  64GB (2 x 32GB) 288-Pin PC RAM DDR5 6000, WD NVMe 2Tb x 1, Sabrent NVMe 2Tb x 1, RTX 4090 FE, Corsair RM1000W PSU, Win11 Home, LG Ultra Curved Gsync Ultimate 3440x1440, Phanteks Enthoo Pro Case, TCA Boeing Edition Yoke & TQ, Cessna Trim Wheel, RTSS Framerate Limiter w/ Front Edge Sync.

Aircraft used in MSFS 2024:  Fenix A320,  Aerosoft CRJ, FBW, WT 787X, I-Fly 737 MAX 8, Citation Longitude.

 

I went from an IB 3570K 4.3Ghz to an IB-E 4820K 4.5 Ghz (1,34 Vcore). Temps with a Corsair h80i are about 10c cooler in a maximum heat stresstest (92C->83C with OCCT linpack).

 

I haven't had the time to tweak it further, I think I can bring the Vcore and max temps lower.

 

Temps with normal use in FSX is about 55-60C.

 

Note that I use hyperthreading (4820K) and 3570K not. The 4820K is 4-core. I guess the average temps are about 10-15C lower than the IB on the same OC.

Ivy-E is overclocking slightly lower than Sandy-E in general, even thou they both have soldered heatsink. It behaves pretty much like the de-lidded regular Ivy Vs regular Sandy. Ivy-E uses a lot less power thou. If you want a quad I'd recommend the Haswell, unless you plan on using more than one GPU.

  • Author

I wonder if I can OC it more then 4.5 / 4.6 if I turn off HT.

the review that I was addressed to by Noel talks about OC when HT was enabled, it could be that turning off HT we can squeeze a bit more juice.

did any of you guys tried getting to the Max GHz with HT Disabled?

Joel Strikovsky
Banner_FS2Crew_NGX_Driver.jpg

I wonder if I can OC it more then 4.5 / 4.6 if I turn off HT

 

 

Don't forget this stark reality:  the higher the OC, the fasting the approaching point of diminishing returns:  

  • that extra 100Mhz from 4.6 to 4.7Ghz will generate a ~2.1% increase in non-GPU-limited 'performance'.  In a double-blinded evaluation you would not see a subjectively nor statistically different outcome.
  • that extra 100Mhz adds exponentially higher heat production and power consumption.  Note the big upsweep starts around 3.9Ghz, and temps go up w/ watts:

     

Very nice to learn IB-E does fluxless solder.  I'm confident now if my SB-E ever dies IB-E will be a suitable replacement, though performance gains will be largely theoretical/minimal I'm afraid.  That's ok though because this is a fabulous machine as it is w/ SB-E.  What we need now is software that fully exploits its hardware processing power.

Noel

System:  9900X3D Noctua NH-D15 G2, MSI Pro 650-P WiFi, G.SKILL  64GB (2 x 32GB) 288-Pin PC RAM DDR5 6000, WD NVMe 2Tb x 1, Sabrent NVMe 2Tb x 1, RTX 4090 FE, Corsair RM1000W PSU, Win11 Home, LG Ultra Curved Gsync Ultimate 3440x1440, Phanteks Enthoo Pro Case, TCA Boeing Edition Yoke & TQ, Cessna Trim Wheel, RTSS Framerate Limiter w/ Front Edge Sync.

Aircraft used in MSFS 2024:  Fenix A320,  Aerosoft CRJ, FBW, WT 787X, I-Fly 737 MAX 8, Citation Longitude.

 

Coolaler.com community member "Toppc" scored an engineering sample of Intel's upcoming Core i7-4960X "Ivy Bridge-E" socket LGA2011 processor, and wasted no time in taking a peek inside its integrated heatspreader (IHS). Beneath the adhesive layer that holds the IHS to the package, which could be fairly easily cut through, "Toppc" discovered that Intel is using a strong epoxy/solder to fuse the processor's die to the IHS, and not a thermal paste, like on Core i7-3770K. Solders tend to have better conductivity than pastes, but make it extremely difficult to de-lid the processors, not to mention potentially disastrous. In the process of delidding this chip, "Toppc" appears to have knocked out a few components around the die. Unless you're good at precision soldering, something like that would be a fatal blow to your $1000 investment.And now we know what is under the IHS.

 

 

 

So that's epoxy solder, glue in other words. Cures at room temperature. No heat, not proper flux-less solder.

 

I would say epoxy glue wouldn't be as good in terms of it's thermal qualities as flux-less solder... but better than TIM perhaps.

 

http://www.techpowerup.com/186209/intel-core-i7-4960x-de-lidded.html

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