January 19, 201313 yr Ivy Bridge Pictorial De-lidding Guide: So far so good, I'm hopeful to make it on the first attempt (but ready for more): @BimmerCop and TechguyMaxC : thank you so much for your guidance and inspiration. Cheers, Dirk.
January 19, 201313 yr Commercial Member Ivy Bridge Pictorial De-lidding Guide: So far so good, I'm hopeful to make it on the first attempt (but ready for more): @BimmerCop and TechguyMaxC : thank you so much for your guidance and inspiration. Cheers, Dirk. You are welcome, brother!! Enjoy your build! Regards, Efrain RuizLiveDISPATCH @ http://www.livedispatch.org (CLOSED) ☹️
January 19, 201313 yr Do I understand it right after delidding I'll need to evenly spread LMPro over the whole chip surface and underside of IHS? And in those areas where is the glue I'll just peel it off and clean up the affected surface and will not cover it with anything? Thanks, Dirk.
January 19, 201313 yr Commercial Member Do I understand it right after delidding I'll need to evenly spread LMPro over the whole chip surface and underside of IHS? And in those areas where is the glue I'll just peel it off and clean up the affected surface and will not cover it with anything? Thanks, Dirk. No, only put LMPro on the cpu die, NOT under the IHS. Spread it on the cpu die using the supplied brush. As for the glue, I used my nail. It will come off if you scrape it gently with your nail. Patience is the key! lol Regards, Efrain RuizLiveDISPATCH @ http://www.livedispatch.org (CLOSED) ☹️
January 19, 201313 yr Commercial Member Yes the finger nail is perfect for removing the Intel silicon adhesive followed up with 90% rubbing alcohol. Cheers jja Jim Allen[email protected]SkyPilot Software home of FSXAssist / P3DAssist
January 19, 201313 yr @BimmerCop and TechguyMaxC : thank you so much for your guidance and inspirationYou are welcome, brother!! Enjoy your build! I'd like to give you a hug too. :Kiss:
January 19, 201313 yr Commercial Member I'd like to give you a hug too. :Kiss: Awwww I love you too, Oz! Hahahaha No homo! Sent from my Galaxy Nexus using Tapatalk 2 Regards, Efrain RuizLiveDISPATCH @ http://www.livedispatch.org (CLOSED) ☹️
January 19, 201313 yr I should have added Great Ozzie, McLaren, westman and jjjallen to the credist above. Thank you, guys, all the same! Dirk. Awwww I love you too, Oz! Hahahaha No homo! Hahahaha, and No sexism! ('don't look don't see') Dirk.
January 19, 201313 yr Lapping is not necessary IMO. That's what a good thermal paste is for. It fills all the micro gaps. Also the 3770 die is NOT flat by design. After delidding there will be a tiny gap between the IHS and the CPU IC and you will notice that you can rock the IHC. This will allow for better contact even if the IHC is seated askew a tad. Again - use a non-conductive past like a diamond brand and coat all pieces with a thin layer to ensure coverage and adding an extra thin bead in the direction of the die won't hurt. The TP is doing all the work for you. Cheers jja What do you mean can rock the IHC? I have both LMPro and Antec Formula 7, but it's thermal conductivity is just 8.3 W/mK vs. ~80 W/mK of LMPro reported by TechguyMaxC, but I could not find the supporting numbers in the tech specifications on LMPro though. A good thermal paste will fill all the micro gaps (as like as LMPro should I surmise), but 8.3 W/mK looks really low. Thanks, Dirk.
January 20, 201313 yr Commercial Member Yes but the CoolLaboratories paste is applied much thinner. Besides that I steer away from metal (conductive) pastes. I'm getting a 13-18c cooing effect with the Formual 7 so I;m happy. Yes the die has rounded edges by design. Cheers jja Jim Allen[email protected]SkyPilot Software home of FSXAssist / P3DAssist
January 20, 201313 yr Besides that I steer away from metal (conductive) pastes. Cheers jja May I ask 'Hwy'? :smile: Thanks, Dirk.
January 20, 201313 yr I have both LMPro and Antec Formula 7, Ok guys I am willing to give it another try with the new CPU after my little run-in I had. now please help me out here. I used a thermal paste that was not mentioned here in the thread as that was what I had left from a previous build and import of the paste. It is called "Gelid GC extreme". At the time it seemed when I imported it, to be one of the more "good" thermal pastes from reviews I read and I never had isues with using that between cpu and water cooler block, but maybe it is not any good for between die and lid. now here you guys talk about LMPRO and coolebarotis "liquid" that is unlike mine that is a paste. Would you guys send me a link or two or thee, of the stuff I need to import. Yes I have googled it but neeed to be sure. I just want to make sure I import the corect stuff. - living in africa is not just get in your car and get/return the stuff at the shop around the corner and it is not available locally. Much appreciated. Is this the stuff I need to get ? http://www.frozencpu...e_Material.html ot this http://www.frozencpu...l?tl=g8c127s451
January 20, 201313 yr Most use Liquid Pro Bob, in your first link. Some prefer liquid Ultra though, because it's ssupposed to clean off better, and be a bit easier to apply. It is said, that Pro is slightly better for cooling.
January 20, 201313 yr I'm moving on with my build: @TechguyMaxC: I'm somewhat worried that BIOS1604 does not mention anywhere the memory is in the dual-channel mode (unlike my previous ASROCK Z68 for example). I messed with the AI Overclock Tuner @ X.M.P., while still on the floor, set it to Profile 1 and BIOS reads RAM: 8192 Gb Frequency: 2666Mhz. I hope it's in dual-channel. Thanks, Dirk.
January 20, 201313 yr Author Dirk, load CPU-Z and check the memory tab to find out if you're in dual channel. If not, just move one of your RAM sticks.
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